龙8国际手机

上海市集成电路行业协会
微信二维码

芬兰驻上海总领事馆商务处寻SMT和COB外包供应商

作者:SICA 发布日期:2012年11月27日 星期二

芬兰驻上海总领事馆商务处受一家芬兰公司委托,在国内寻找SMT和COB外包供应商,客户要求如下: 

Requirement:

· The supplier can do both, CoB assembly after SMT 能同时做CoB和SMT

· Supplier shall have capability for low volume – high mix production, hunreds to thousands pieces per month 小量多样生产,每月几百至几千片不等

· Supplier is working and supplying products to international companies 有服务国际客户经验

SMT

• Automatic paste printing, component placement and reflow capability (RoHS) 自动锡膏印刷,元件替换及回流,欧盟RoSH

– There is not special requirements related to SMT which suppliers generally can do

– Component packages are from 0402 to 0.4mm pitch CSP

• Cleaning is required after reflow, supplier shall have automatic cleaning capability 回流后自动清洁能力

• AOI for paste printing is preferred, Xray inspection capability would be good to have 自动光学检测,X光检测更佳

CoB – Chip On Board

• Assembly work needs to be done in Cleanroom, at least class 10 000 10000级以上清洁室

• Supplier shall have plasma cleaning capability 等离子清洗能力

• Supplier shall have automatic die bonding capability, high placement accuracy is required 自动芯片焊接,高精度贴装

– Glue dispensing _ die placement _ Curing

• Supplier shall have at least ultrasonic Al wedge bonding capability, Au thermosonic would be good to have as well 至少有铝丝超声焊,金丝热超声焊更佳

– Including wire pull strength testing capability 拉线强度测试能力

• Supplier shall have automatic dispensing equipment for wire protection/encapsulation 自动点胶设备用于线保护/封装

联系人:姚磊竑 

芬兰驻上海总领事馆商务处 商务专员 

地址:上海市浦东新区碧波路690号2号楼402室,201203

电话:+86 21 6104 2288

传真:+86 21 6104 2289

关闭本窗口
神话网投官网平台千亿国际下载威廉希尔
网站地图